Breakout panel for AP570 series. Converts 68-pin CHAMP to two TRB jacks and one DB15 connector.
|Dimensions||3.25 × 1.25 × 1 in|
These modules provide a dual redundant MIL-STD-1553 channel with four open/ground avionics level ( 35V) discrete I/O signals in addition to IRIG-B input and Trigger I/O. Hard wired RT address signal input pins are also available at the connector.
This Acropack card utilizes the latest AIM Common Hardware Core derived from the field proven MIL-STD-1553 interface to deliver low power consumption and high performance for rugged environments and embedded applications.
AP571-000: Single function MIL-STD-1553.
AP572-000: Full multi-function MIL-STD-1553.
Options (Contact factory for ordering): Direct coupled MIL-STD-1553 bus. | Safety critial monitoring only (Tx inhibit). | Polyurethane conformal coating.
The AcroPack® product line updates our popular Industry Pack I/O modules with a PCIe interface format. This tech-refresh design offers a compact size, low-cost I/O, and a rugged form factor. Combining different AcroPack module types on one XMC, VPX, or PCIe carrier allows for a simplified modular approach to system assembly.
Designed for COTS applications these avionics communication mezzanine modules deliver high-density, high-reliability, and high-performance at a low cost.
The AP570 series modules are 70mm long, which is 19.05mm longer than the full-length mini PCIe card at 50.95mm. The board’s width is the same as an mPCIe board of 30mm and uses the same mPCIe standard board hold down standoff and screw keep-out areas.
A down-facing 100-pin Samtec connector mates with the carrier card. This ensures a secure connection for your I/O without the vulnerabilities of cabling.
X1 Lane PCIe Interface: Compatible with PCI-Express Standard (Release 2.0).
Memory: 128MB RAM.
Processor: SoC device with 2x 400MHz processors.
Time Tagging: 46-bit absolute IRIG-B formatted.
Discrete I/O: 4 open/ground avionics level discrete I/O. 2 LVTTL digital discrete inputs. 6 signals listed above can be used for RT address inputs.
Trigger I/O: 1 BC/BM trigger Input and 1 BC/BM trigger output.
Encoder/Decoder: 1x MIL-STD-1553 Encoder/decoder with full error detection bus support.
Physical Bus Interface: Transformer coupled MIL-STD-1553 bus or optional direct coupled MIL-STD-1553 bus.
Connector: 100 pin board to board samtec connector.
Dimensions: 70mm x 30mm.
Operating Temperature Range:
-40°C to 85°C for conduction cooled applications measured at FPGA component case.
-40°C to 70°C for air cooled applications measured at ambient air with 200lfm airflow.
Storage Temperature Range: -55℃ to 125.
Relative Humidity: 5 to 95% non-condensing.
Operational Shock: Tested to IEC 60068-2-27: 30G, 11ms half sine, 50G, 3mS half, 18 shocks at 6 orientations for both test levels.
Sinusoidal Operating Vibration: Tested to IEC 60068-2-6: 10-500Hz, 5G, 2 hours/axis.
Random Operating Vibration: Tested to IEC 60068-2-64: 10-500Hz, 5G-rms, 2 hours/axis.
Weight 0.8 oz Dimensions 3.25 × 1.25 × 1 in Communication
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